Power Module Packaging Market size was valued at USD 1.86 Bn in 2023 and Power Module Packaging Market revenue is expected to reach USD 3.58 Bn by 2030, at a CAGR of 9.79% over the forecast period.The global Power Module Packaging market refers to the industry involved in packaging and assembling power semiconductor modules used in various applications such as power electronics renewable energy systems electric vehicles and more.